Einladung zum virtuellen Stammtisch: KI-ready – Schritt für Schritt zur digitalisierten Produktion Kompetenzzentrum Usability
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
JMMP | Free Full-Text | Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | SpringerLink
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
9 Gründe für den Einsatz eines inline Düsen-Viskosimeters... - Innonet Kunststoff
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
9 Gründe für den Einsatz eines inline Düsen-Viskosimeters... - Innonet Kunststoff
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applied sciences
applied sciences
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics | SpringerLink
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
applied sciences
PDF) Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Applied Sciences | Free Full-Text | Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding
Peter WAPPLER | PhD | Institute for Micro Assembly Technology of the Hahn- Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies
JMMP | Free Full-Text | An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
Digitale Prozessmodelle für den Spritzguss - Hahn-Schickard
JMMP | Free Full-Text | Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile
Dr. Achim Bittner - Gruppenleiter akustische MEMS - Hahn-Schickard | XING
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
